{"links":{},"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00099388","sets":["1164:2822:7504:7505"]},"path":["7505"],"owner":"11","recid":"99388","title":["三次元積層マルチコアプロセッサにおけるチップ温度を考慮した電圧制御"],"pubdate":{"attribute_name":"公開日","attribute_value":"2014-03-08"},"_buckets":{"deposit":"eced3fe2-53dd-4c99-8be3-2d9a176c2a2e"},"_deposit":{"id":"99388","pid":{"type":"depid","value":"99388","revision_id":0},"owners":[11],"status":"published","created_by":11},"item_title":"三次元積層マルチコアプロセッサにおけるチップ温度を考慮した電圧制御","author_link":["0","0"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"三次元積層マルチコアプロセッサにおけるチップ温度を考慮した電圧制御"},{"subitem_title":"Voltage control considering the chip temperature in the three-demensional stacked multi-core processors","subitem_title_language":"en"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"CPU/GPUと電力制御","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2014-03-08","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"慶應義塾大学"},{"subitem_text_value":"慶應義塾大学"},{"subitem_text_value":"慶應義塾大学"},{"subitem_text_value":"慶應義塾大学"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Keio University","subitem_text_language":"en"},{"subitem_text_value":"Keio University","subitem_text_language":"en"},{"subitem_text_value":"Keio University","subitem_text_language":"en"},{"subitem_text_value":"Keio University","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/99388/files/IPSJ-EMB14032041.pdf"},"date":[{"dateType":"Available","dateValue":"2100-01-01"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-EMB14032041.pdf","filesize":[{"value":"2.6 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"42"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"fac6c43f-b321-4aa4-9d75-47b10df66fd7","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2014 by the Institute of Electronics, Information and Communication Engineers\nThis SIG report is only available to those in membership of the SIG."}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"藤田, 悠"},{"creatorName":"小泉, 祐介"},{"creatorName":"宇野, 理恵"},{"creatorName":"天野, 英晴"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Yu, Fujita","creatorNameLang":"en"},{"creatorName":"Yusuke, Koizumi","creatorNameLang":"en"},{"creatorName":"Rie, Uno","creatorNameLang":"en"},{"creatorName":"Hideharu, Amano","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA12149313","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"ビルディングブロック型計算システムのプロトタイプとしてワイヤレスチップ間接続を用いた Cube-1 が開発された。問題点としてワイヤレスチップ間接続を用いることでチップが完全に独立してしまい、TSV による積層チップなどと比較して中層のチップに熱がたまりやすいことが挙げられる。そこで本論文ではチップ内に組み込まれたリークモニタを温度を測るセンサとして用いて、チップ温度を観測し電圧を制御する手法を提案する。また温度によるチップの特性を調査し、チップ温度ごとに最適な電圧値を設定することでエネルギー効率の向上を目指す。提案である電圧制御を行うことで最大 5％のエネルギー効率の向上が見込まれる。","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"Cube-1 is a prototype heterogeneous multiprocessor using inductive coupling wireless TCI (Through Chip Interface). Since intermediate chips in the stack are separated from the air and print circuit board, the thermal of the chip tends to be separated from others. In order to control the supply voltage of such chips sand-witched by the other chips, a leak monitor embedded in the chip is utilized. If the leakage current of the chip becomes too large, the power of the chip is shut down in order to avoid the thermal run-away. Also, by measuring the temperature precisely from the leak monitor, we can lower the supply voltage so that the delay with the measured temperature satisfies the programmed delay. By using this method, energy efficiency can be improved by 5% at maximum.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告組込みシステム（EMB）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2014-03-08","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"41","bibliographicVolumeNumber":"2014-EMB-32"}]},"relation_version_is_last":true,"weko_creator_id":"11"},"created":"2025-01-18T23:45:25.654616+00:00","updated":"2025-01-21T12:05:35.274486+00:00","id":99388}