{"links":{},"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00071814","sets":["1164:2036:6262:6263"]},"path":["6263"],"owner":"10","recid":"71814","title":["Via数削減による大規模LSIレイアウトの高速DRC手法"],"pubdate":{"attribute_name":"公開日","attribute_value":"2011-01-10"},"_buckets":{"deposit":"c9f2599b-f35b-4d36-9809-ec962125374b"},"_deposit":{"id":"71814","pid":{"type":"depid","value":"71814","revision_id":0},"owners":[10],"status":"published","created_by":10},"item_title":"Via数削減による大規模LSIレイアウトの高速DRC手法","author_link":["0","0"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Via数削減による大規模LSIレイアウトの高速DRC手法"},{"subitem_title":"The High-speed DRC Technique for VLSI Layout by Reducing Vias","subitem_title_language":"en"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"システムLSI設計技術","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2011-01-10","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"TOOL株式会社EDA製品事業部"},{"subitem_text_value":"TOOL株式会社EDA製品事業部"},{"subitem_text_value":"TOOL株式会社EDA製品事業部"},{"subitem_text_value":"早稲田大学大学院情報生産システム研究科"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Technical Department EDA Product Division, TOOL Corporation","subitem_text_language":"en"},{"subitem_text_value":"Technical Department EDA Product Division, TOOL Corporation","subitem_text_language":"en"},{"subitem_text_value":"Technical Department EDA Product Division, TOOL Corporation","subitem_text_language":"en"},{"subitem_text_value":"The Graduate School of Information, Production and System, Waseda University","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/71814/files/IPSJ-SLDM11148017.pdf","label":"IPSJ-SLDM11148017"},"date":[{"dateType":"Available","dateValue":"2013-01-10"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-SLDM11148017.pdf","filesize":[{"value":"667.6 kB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"10"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"931326d0-e4ed-42fd-afd3-94deb9b1f36e","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2011 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"亀井, 智紀"},{"creatorName":"安部, 拓哉"},{"creatorName":"本垰, 秀昭"},{"creatorName":"渡邊, 孝博"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Tomoki, Kamei","creatorNameLang":"en"},{"creatorName":"Takuya, Anbe","creatorNameLang":"en"},{"creatorName":"Hideaki, Hontao","creatorNameLang":"en"},{"creatorName":"Takahiro, Watanabe","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11451459","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"GDSⅡ などのレイアウトデータでは，多層配線の配線間の接続箇所に Via が使用されているが，近年，DFM （Design for Manufacturability） 技術の浸透により，配置される Via の数が爆発的に増加している．Via 図形のデータが増加すると，DRC （Design Rule Check） を行う EDA ツールにとっては，計算コストが増大し，解析に多くの時間とメモリ空間を必要とする．そこで本研究では，解析データから Via を必要最小限まで擬似的に削減し，その上で DRC の一つである配線幅チェックを行った．Via を削減しない場合と比較して，数倍～数百倍解析時間が短縮された．","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"In layout data such as GDS II, Vias are used for connection points between multilayer wiring. In recent years, the number of Vias to be arranged has been increasing explosively in accordance with the spread of DFM (Design for Manufacturability) technology. Increase of Via graphic data would rise computation costs for an EDA tool that performs DRC (Design Rule Check) and require long time and memory space for an analysis. Therefore, in this study, Vias were spuriously reduced to minimum from analysis data and the wire width was checked, which was one of the DRCs. Comparing with the case that Vias are not reduced, analysis time has been shortened by several times - several hundred times.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告システムLSI設計技術（SLDM）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2011-01-10","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"17","bibliographicVolumeNumber":"2011-SLDM-148"}]},"relation_version_is_last":true,"weko_creator_id":"10"},"created":"2025-01-18T23:30:34.591282+00:00","updated":"2025-01-21T22:40:18.394364+00:00","id":71814}