{"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00027848","sets":["1164:2036:2104:2107"]},"path":["2107"],"owner":"1","recid":"27848","title":["プリント配線板を対象とした二層均等化スペーシング手法（レイアウトと一般）"],"pubdate":{"attribute_name":"公開日","attribute_value":"1996-05-24"},"_buckets":{"deposit":"a31c5621-2385-4c2b-aed8-d4da15b31db3"},"_deposit":{"id":"27848","pid":{"type":"depid","value":"27848","revision_id":0},"owners":[1],"status":"published","created_by":1},"item_title":"プリント配線板を対象とした二層均等化スペーシング手法（レイアウトと一般）","author_link":["0","0"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"プリント配線板を対象とした二層均等化スペーシング手法（レイアウトと一般）"},{"subitem_title":"A Spacing Algorithm for Double - Sided Printed Wiring Boards","subitem_title_language":"en"}]},"item_type_id":"4","publish_date":"1996-05-24","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"早稲田大学理工学部電子通信学科"},{"subitem_text_value":"早稲田大学理工学部電子通信学科"},{"subitem_text_value":"早稲田大学理工学部電子通信学科"},{"subitem_text_value":"早稲田大学理工学部電子通信学科"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Dept. of Electronics and Communication Engineering Waseda University","subitem_text_language":"en"},{"subitem_text_value":"Dept. of Electronics and Communication Engineering Waseda University","subitem_text_language":"en"},{"subitem_text_value":"Dept. of Electronics and Communication Engineering Waseda University","subitem_text_language":"en"},{"subitem_text_value":"Dept. of Electronics and Communication Engineering Waseda University","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/27848/files/IPSJ-SLDM96080002.pdf"},"date":[{"dateType":"Available","dateValue":"1998-05-24"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-SLDM96080002.pdf","filesize":[{"value":"414.7 kB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"10"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"5c7d1f4a-caab-48d2-9465-8f673b6400bc","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 1996 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"金井, 宏和"},{"creatorName":"戸川, 望"},{"creatorName":"佐藤政生"},{"creatorName":"大附, 辰夫"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Hirokazu, Kanai","creatorNameLang":"en"},{"creatorName":"Nozomu, Togawa","creatorNameLang":"en"},{"creatorName":"Masao, Sato","creatorNameLang":"en"},{"creatorName":"Tatsuo, Ohtsuki","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11451459","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"プリント配線板の設計では，部品を配置した後，部品間を配線する．そのため，必ずしも配置された部品間をすべて配線できるとは限らない．配線設計に先だって，配線が可能になるように配置された部品を移動する処理をスペーシングと呼ぶ．本稿では，基板の両面に部品を配置配線する表面実装技術を用いた二層のプリント配線板を対象としたスペーシング手法を提案する．本手法は，部品間の配線本数に応じて配線に必要な間隔を配線領域に与えるように部品を再配置する．配置された部品同士に重なりなどの設計規則違反がある場合には，配線に必要な間隔を配線領域の確保し，同時に部品の重なりを除去することで，違反を解決する．提案手法を計算機上に実装し，手法の有効性を確認した．","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"In design of printed wiring boards, after parts are placed on them, wires are routed among the parts. Thus all wires cannot always be routed among the placed parts. Spacing is the process to move the preplaced parts so that all wires can be routed. In this paper, we propose a spacing algorithm for double-sided printed wiring boards, on both sides of which parts are placed and wires are routed. The algorithm moves the preplaced parts so as to take the space in proportion to the number of wires among the parts. If the initial layout has violations of the design rules such as overlaps of the preplaced parts, the algorithm resolves the violations, Experimental show that the algorithm is effective.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"14","bibliographic_titles":[{"bibliographic_title":"情報処理学会研究報告システムLSI設計技術（SLDM）"}],"bibliographicPageStart":"9","bibliographicIssueDates":{"bibliographicIssueDate":"1996-05-24","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"51(1996-SLDM-080)","bibliographicVolumeNumber":"1996"}]},"relation_version_is_last":true,"weko_creator_id":"1"},"id":27848,"updated":"2025-01-22T18:20:01.616001+00:00","links":{},"created":"2025-01-18T22:58:06.239401+00:00"}