{"links":{},"id":241833,"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00241833","sets":["1164:3027:11889:11890"]},"path":["11890"],"owner":"44499","recid":"241833","title":["食用金粉を用いた回路制作のためのマテリアル検討"],"pubdate":{"attribute_name":"公開日","attribute_value":"2025-01-07"},"_buckets":{"deposit":"5ac79417-be05-4f43-9f76-bc1e3cf339b7"},"_deposit":{"id":"241833","pid":{"type":"depid","value":"241833","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"食用金粉を用いた回路制作のためのマテリアル検討","author_link":["666430","666431"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"食用金粉を用いた回路制作のためのマテリアル検討"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"セッション5: デザイン・ファブリケーション","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2025-01-07","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"お茶の水女子大学"},{"subitem_text_value":"お茶の水女子大学"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/241833/files/IPSJ-HCI25211021.pdf","label":"IPSJ-HCI25211021.pdf"},"date":[{"dateType":"Available","dateValue":"2027-01-07"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-HCI25211021.pdf","filesize":[{"value":"9.3 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"33"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"a650dde1-5d4a-4982-a23d-f656cf7e5cc7","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2025 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"入江, 有紀"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"五十嵐, 悠紀"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA1221543X","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8760","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"本研究では，食用金粉をペースト状に加工して回路として利用可能な新たなマテリアルの開発を目指し，さまざまな実験を行った．3D プリンタを用いて作成した型と，アクリル板を素材に用いた型を比較し，それぞれを評価した．また，パラメータを変更した各配合のマテリアルに対して，初期段階として短時間の通電実験を行い，その後，初期段階で良好な結果を示したマテリアルについて，さらに長時間の通電耐久試験を実施した．経時的な抵抗値の変動やマテリアルの劣化状況についても詳細に観察した結果，回路形成において安定した通電を可能にする特定の配合条件を確認でき，実用化に向けた有用な知見が得られた．本稿では，これらの実験結果を踏まえ，通電可能なマテリアルの最適な組成について報告する．","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"7","bibliographic_titles":[{"bibliographic_title":"研究報告ヒューマンコンピュータインタラクション（HCI）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2025-01-07","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"21","bibliographicVolumeNumber":"2025-HCI-211"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"created":"2025-01-19T01:46:40.633708+00:00","updated":"2025-01-19T07:31:34.625499+00:00"}