{"links":{},"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00240529","sets":["1164:2036:11466:11785"]},"path":["11785"],"owner":"44499","recid":"240529","title":["オープンソースEDAを用いたLSI設計とテープアウト事例"],"pubdate":{"attribute_name":"公開日","attribute_value":"2024-11-05"},"_buckets":{"deposit":"963389bd-9c4c-4f0b-8f29-0525e0a61ee3"},"_deposit":{"id":"240529","pid":{"type":"depid","value":"240529","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"オープンソースEDAを用いたLSI設計とテープアウト事例","author_link":["660026","660030","660024","660028","660031","660029","660023","660027","660022","660025"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"オープンソースEDAを用いたLSI設計とテープアウト事例"},{"subitem_title":"LSI Design and Tape-Out Case Studies Using Open-Source EDA","subitem_title_language":"en"}]},"item_type_id":"4","publish_date":"2024-11-05","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"産業技術総合研究所 先端半導体研究センター"},{"subitem_text_value":"産業技術総合研究所 先端半導体研究センター"},{"subitem_text_value":"産業技術総合研究所 先端半導体研究センター"},{"subitem_text_value":"産業技術総合研究所 先端半導体研究センター"},{"subitem_text_value":"産業技術総合研究所 先端半導体研究センター"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"National Institute of Advanced Industrial Science and Technology (AIST)","subitem_text_language":"en"},{"subitem_text_value":"National Institute of Advanced Industrial Science and Technology (AIST)","subitem_text_language":"en"},{"subitem_text_value":"National Institute of Advanced Industrial Science and Technology (AIST)","subitem_text_language":"en"},{"subitem_text_value":"National Institute of Advanced Industrial Science and Technology (AIST)","subitem_text_language":"en"},{"subitem_text_value":"National Institute of Advanced Industrial Science and Technology (AIST)","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/240529/files/IPSJ-SLDM24207047.pdf","label":"IPSJ-SLDM24207047.pdf"},"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-SLDM24207047.pdf","filesize":[{"value":"1.7 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"10"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_login","version_id":"fec2b47f-9b3b-4246-92c5-49440fabc05a","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2024 by the Institute of Electronics, Information and Communication Engineers This SIG report is only available to those in membership of the SIG."}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"日置, 雅和"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"片下, 敏宏"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"堀, 洋平"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"更田, 裕司"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"秋田, 一平"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Masakazu, Hoki","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Toshihiro, Katashita","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yohei, Hori","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Hiroshi, Fuketa","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Ippei, Akita","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11451459","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8639","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"現在の半導体設計開発では PDK，EDA ツール，IP からなるエコシステムが形成されており，独自の半導体開発を目指す新規参入者の障壁となる場合があった．これに対し，Google 社，efabless 社，Skywater 社は「誰にでも手が届く半導体の開発」を目指し，オープンソース EDA/PDK をリリースすると共にオープン MPW シャトルプログラムを 2020 年頃から開始した．このプログラムは世界中で 600 件以上の利用実績があり日本でも利用が増えているが，具体的な設計事例の情報は少ない．我々はこれまでに開発した回路 IP 等を活用し，オープンソース EDA/PDK を用いた半導体設計を試行するなかで，オープンソース EDA の利用方法等の知見を蓄積・公開することでその普及促進を図る活動をすすめている．今回はオープンソース EDA 環境を用いたデジタル回路設計とテープアウト事例について報告する．","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"In the current semiconductor design and development, an ecosystem consisting of PDK, EDA tools, and IP has been formed, which can be a barrier for new entrants aiming to develop their own semiconductors. In response to this, Google, efabless, and skywater have released an open-source EDA/PDK and launched the Open MPW Shuttle Program around 2020 with the aim of \"developing semiconductors that are within reach of everyone\". This program has been used in over 600 cases around the world and is increasingly being used in Japan, but there is little information on specific design cases. We are promoting the spread of open-source EDA by accumulating and publishing knowledge on how to use open source EDA while trying out semiconductor design using open source EDA/PDK, utilizing the circuit IP we have developed so far. In this article, we report on a case study of digital circuit design and tape-out using an open-source EDA environment.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"4","bibliographic_titles":[{"bibliographic_title":"研究報告システムとLSIの設計技術（SLDM）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2024-11-05","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"47","bibliographicVolumeNumber":"2024-SLDM-207"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"updated":"2025-01-19T07:57:05.062621+00:00","created":"2025-01-19T01:44:46.248505+00:00","id":240529}