{"created":"2025-01-19T01:44:40.578135+00:00","updated":"2025-01-19T07:58:14.117522+00:00","metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00240469","sets":["1164:2036:11466:11784"]},"path":["11784"],"owner":"44499","recid":"240469","title":["同一ロット内のウェハ間特性の空間的類似性を考慮したガウス過程回帰に基づくLSI良品判定手法"],"pubdate":{"attribute_name":"公開日","attribute_value":"2024-10-31"},"_buckets":{"deposit":"88722350-3db5-47db-beac-46c0ae9d39ca"},"_deposit":{"id":"240469","pid":{"type":"depid","value":"240469","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"同一ロット内のウェハ間特性の空間的類似性を考慮したガウス過程回帰に基づくLSI良品判定手法","author_link":["659719","659724","659725","659723","659720","659722","659721"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"同一ロット内のウェハ間特性の空間的類似性を考慮したガウス過程回帰に基づくLSI良品判定手法"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"ポスター","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2024-10-31","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"京都工芸繊維大学"},{"subitem_text_value":"ソニーセミコンダクタマニュファクチャリング株式会社"},{"subitem_text_value":"ソニーセミコンダクタマニュファクチャリング株式会社"},{"subitem_text_value":"ソニーセミコンダクタマニュファクチャリング株式会社"},{"subitem_text_value":"京都工芸繊維大学"},{"subitem_text_value":"京都大学大学院情報学研究科"},{"subitem_text_value":"京都工芸繊維大学"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/240469/files/IPSJ-SLDM24206002.pdf","label":"IPSJ-SLDM24206002.pdf"},"date":[{"dateType":"Available","dateValue":"2026-10-31"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-SLDM24206002.pdf","filesize":[{"value":"2.2 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"10"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"7d82e466-e6c2-4993-ac9a-2a75774f6fa5","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2024 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"五枝, 大典"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"中村, 友紀"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"梶山, 賀生"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"栄木, 誠"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"高山, 創"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"佐藤, 高史"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"新谷, 道広"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11451459","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8639","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"集積回路（Large-scale integrated circuit，LSI）の大規模化と多機能化に伴い，LSI のテストは困難になっている．この課題に対し，ウェハ面上のチップを複数グループに分割して各グループ毎にガウス過程回帰（Gaussian process regression，GPR）を行う手法は，業界標準のテスト手法より高いテスト性能を達成することが報告されている．本稿では，同一ロット内のウェハ同士は互いに特性値が似ていることを利用し，テスト性能のさらなる改善を図る．具体的には，既存手法がウェハ内の GPR 予測結果を集約するのに対し，提案手法では，GPR 予測結果に加え隣接ウェハの実測値を集約することで，予測精度を改善する．量産 LSI テストデータを用いた評価により，従来手法と同等の計算速度を保持しつつ，故障検出率を 6.40% 向上することを示す．","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告システムとLSIの設計技術（SLDM）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2024-10-31","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"2","bibliographicVolumeNumber":"2024-SLDM-206"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"id":240469,"links":{}}