{"id":238273,"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00238273","sets":["6164:6165:7651:11699"]},"path":["11699"],"owner":"44499","recid":"238273","title":["次世代チップレットの高効率設計・及び実装技術：Rapidusの挑戦"],"pubdate":{"attribute_name":"公開日","attribute_value":"2024-08-21"},"_buckets":{"deposit":"ed28ad69-5055-48c3-9141-d782c9c92a94"},"_deposit":{"id":"238273","pid":{"type":"depid","value":"238273","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"次世代チップレットの高効率設計・及び実装技術：Rapidusの挑戦","author_link":["652478"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"次世代チップレットの高効率設計・及び実装技術：Rapidusの挑戦"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"招待講演","subitem_subject_scheme":"Other"}]},"item_type_id":"18","publish_date":"2024-08-21","item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_18_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"Rapidus株式会社"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/238273/files/IPSJ-DAS2024049.pdf","label":"IPSJ-DAS2024049.pdf"},"date":[{"dateType":"Available","dateValue":"2026-08-21"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-DAS2024049.pdf","filesize":[{"value":"809.3 kB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"5"},{"tax":["include_tax"],"price":"0","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"10"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"e4468e77-9573-4641-8cac-0d06f53d0013","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2024 by the Information Processing Society of Japan"}]},"item_18_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"河崎, 一茂"}],"nameIdentifiers":[{}]}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_5794","resourcetype":"conference paper"}]},"item_18_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"先端半導体とパッケージング技術の進歩は，半導体業界に革命をもたらしています．チップレット技術は複数の小さなチップを組み合わせて 1 つの大きなパッケージを形成する手法であり，SoC チップの機能ごとに分割することで，歩留まり向上，設計開発期間の短縮，低コスト化，高性能化など多くの利点があります．しかし，パッケージ構造の複雑化により設計の難易度が飛躍的に増加しています．本講演では，Rapidus が目指す最先端チップレットパッケージ（2.xD, 3D）技術と，それを実現するための設計環境構築の課題について解説します．","subitem_description_type":"Other"}]},"item_18_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"295","bibliographic_titles":[{"bibliographic_title":"DAシンポジウム2024論文集"}],"bibliographicPageStart":"295","bibliographicIssueDates":{"bibliographicIssueDate":"2024-08-21","bibliographicIssueDateType":"Issued"},"bibliographicVolumeNumber":"2024"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"updated":"2025-01-19T08:37:01.062459+00:00","created":"2025-01-19T01:41:24.185427+00:00","links":{}}