@techreport{oai:ipsj.ixsq.nii.ac.jp:00023705,
 author = {米田, 勳生 and 松本, 清人 and 長堀, 剛 and 芝, 和宏 and 千賀, 賢一 and 三好, 一徳 and I., Yoneda and K., Matsumoto and T., Nagahori and K., Shiba and K., Senga and K., Miyoshi},
 issue = {34(2000-ARC-138)},
 month = {Apr},
 note = {交換機や超並列計算機等の装置間、装置内大容量データ伝送用の622Mbps/ch×12ch送受信モジュールを開発した。実装コストの低減に有利なパッシブアライメント実装技術を波長1.3μmの12chファブリペロレーザと12ch-InGaAsPINフォトダイオードの実装に適用して、低コストで体積2.2ccの小型のモジュールを実現した。マルチモードファイバを用いて送受信モジュールの100m伝送を確認した。, 622Mbps/ch 12-channel transmitter and receiver module has been developed for intra- and inter-cabinet interconnection in massively parallel computers and large-scale ATM switching systems. Precise tree-dimensional passive alignment of a 12-channel 1.3μm laser diode(LD) and a 12-channel InGaAs PIN photo diode can be assembled without optical adjustment, so that low cost and a compact size of 2.2cc are achieved. The applicability of newly developed transmitter and receiver module has been demonstrated through a transmission experiment over 100m length of multi-mode optical fibers.},
 title = {並列光インターコネクション用622Mbps/ch×12ch送受信モジュール},
 year = {2000}
}