{"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00228918","sets":["1164:2036:11089:11372"]},"path":["11372"],"owner":"44499","recid":"228918","title":["人工視覚システムのための圧縮伸張チップEG2Cの消費電力評価"],"pubdate":{"attribute_name":"公開日","attribute_value":"2023-11-10"},"_buckets":{"deposit":"670a2c4d-c2a3-4f22-8856-2fb7b20be5a4"},"_deposit":{"id":"228918","pid":{"type":"depid","value":"228918","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"人工視覚システムのための圧縮伸張チップEG2Cの消費電力評価","author_link":["614754","614753","614757","614755","614752","614756"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"人工視覚システムのための圧縮伸張チップEG2Cの消費電力評価"},{"subitem_title":"Evaluation of the power consumption of the codec chip EG2C for a visual prosthesis","subitem_title_language":"en"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"アルゴリズム，VLSI試作・実用化","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2023-11-10","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"近畿大学大学院総合理工学研究科"},{"subitem_text_value":"近畿大学大学院総合理工学研究科"},{"subitem_text_value":"近畿大学理工学部"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Graduate School of Science and Engineering, Kindai University","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science and Engineering, Kindai University","subitem_text_language":"en"},{"subitem_text_value":"Faculty of Science and Engineering, Kindai University","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/228918/files/IPSJ-SLDM23204051.pdf","label":"IPSJ-SLDM23204051.pdf"},"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-SLDM23204051.pdf","filesize":[{"value":"1.3 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"10"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_login","version_id":"e9c4e2fb-12ab-4d39-b3ee-e233efb349f3","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2023 by the Institute of Electronics, Information and Communication Engineers This SIG report is only available to those in membership of the SIG."}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"平山, 聖冴"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"田中, 尚哉"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"武内, 良典"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Shogo, Hirayama","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Naoya, Tanaka","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yoshinori, Takeuchi","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11451459","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8639","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"緑内障や糖尿病網膜症などの疾患により高齢者の後天的な失明患者が増加傾向にある現在，高齢者の負担を軽減するための視覚障害の治療法が求められている．治療法の１つとして視覚野刺激型人工視覚システムの研究開発が進められている．このシステムを実現するためにはシステムの発熱が人体に与える影響やシステムの長時間動作を考慮して，低消費電力化が必須であるとともに，データの処理を高速に実行し，遅延時間を最小にする必要がある．そこで，人工視覚システムに用いる刺激パターンデータの圧縮アルゴリズムとして EGC-EGC アルゴリズムを提案し，ASIC として実装したチップの評価を行った．評価ボード上でテストを行った結果チップの消費電力は圧縮で 10.89mW，伸張で 11.81mW となり，1 フレームの圧縮伸張処理時間は圧縮で0.926ms，伸張で 0.910ms となった．","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"To implement a visual prosthesis, it is essential to reduce the power consumption of the entire system, as well as to process data at high speed and minimize the delay time. Therefore, we proposed the EGC-EGC algorithm as a compression algorithm for stimulus pattern data used in a visual prosthesis, and evaluated a chip implemented as an ASIC. Tests on the evaluation board showed that the chip consumed 10.89 mW for compression and 11.81 mW for decompression. The processing time for compression and decompression of one frame was 0.926ms and 0.910ms, respectively.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告システムとLSIの設計技術（SLDM）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2023-11-10","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"51","bibliographicVolumeNumber":"2023-SLDM-204"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"id":228918,"updated":"2025-01-19T11:40:23.231751+00:00","links":{},"created":"2025-01-19T01:28:03.009832+00:00"}