{"id":226822,"updated":"2025-01-19T12:23:12.493494+00:00","links":{},"created":"2025-01-19T01:26:08.898097+00:00","metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00226822","sets":["1164:2822:11181:11293"]},"path":["11293"],"owner":"44499","recid":"226822","title":["Raspberry Piボードを用いたウェハーアラインメントシステムの実装と評価"],"pubdate":{"attribute_name":"公開日","attribute_value":"2023-07-07"},"_buckets":{"deposit":"496fef85-67dc-460e-8c0c-485f95809dcb"},"_deposit":{"id":"226822","pid":{"type":"depid","value":"226822","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"Raspberry Piボードを用いたウェハーアラインメントシステムの実装と評価","author_link":["603103","603102","603101","603099","603100"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Raspberry Piボードを用いたウェハーアラインメントシステムの実装と評価"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"ロボット・画像処理","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2023-07-07","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"岡山県立大学"},{"subitem_text_value":"岡山県立大学"},{"subitem_text_value":"タツモ株式会社"},{"subitem_text_value":"タツモ株式会社"},{"subitem_text_value":"岡山県立大学"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Okayama Prefectural University","subitem_text_language":"en"},{"subitem_text_value":"Okayama Prefectural University","subitem_text_language":"en"},{"subitem_text_value":"TAZMO CO., LTD.","subitem_text_language":"en"},{"subitem_text_value":"TAZMO CO., LTD.","subitem_text_language":"en"},{"subitem_text_value":"Okayama Prefectural University","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/226822/files/IPSJ-EMB23063003.pdf","label":"IPSJ-EMB23063003.pdf"},"date":[{"dateType":"Available","dateValue":"2025-07-07"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-EMB23063003.pdf","filesize":[{"value":"2.3 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"42"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"cd641bb7-2563-4c7a-83e8-9e4c0b6d0c62","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2023 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"井出, 創一朗"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"横川, 智教"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"坂田, 功介"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"山本, 真裕"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"有本, 和民"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA12149313","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-868X","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"半導体製造プロセスにおいてはシリコンウェハーに対し様々なプロセス処理を行うが，その際にウェハーの位置合わせ（アラインメント）を行う必要がある．従来のウェハーアラインメントでは，産業カメラや IR カメラ等によりウェハー上のアラインメントマークを撮影し，ウェハー間の誤差を計測することでアラインメント処理を実現していた．しかしながら，従来のシステムは高価なカメラを用いる必要があり，それを制御するためにも高性能な計算機が必要であるため，導入コストが非常に大きくなっていた．本研究では，画像の取得およびアラインメントの計測に Raspberry Pi と安価なカメラを用いることで，低コストでウェハーアラインメントを実現することを目的とする．さらに，撮影した画像に対してソフトウェアによる画像処理を施すことで，低解像度のカメラでも十分な精度を実現する．","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"7","bibliographic_titles":[{"bibliographic_title":"研究報告組込みシステム（EMB）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2023-07-07","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"3","bibliographicVolumeNumber":"2023-EMB-63"}]},"relation_version_is_last":true,"weko_creator_id":"44499"}}