{"updated":"2025-01-19T13:26:03.264244+00:00","metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00223356","sets":["1164:3027:11083:11084"]},"path":["11084"],"owner":"44499","recid":"223356","title":["3Dプリンタによるホットスタンプ多層回路における回路の最適化のための検討"],"pubdate":{"attribute_name":"公開日","attribute_value":"2023-01-09"},"_buckets":{"deposit":"25991b3e-4b89-4929-b93f-ae97dda464cd"},"_deposit":{"id":"223356","pid":{"type":"depid","value":"223356","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"3Dプリンタによるホットスタンプ多層回路における回路の最適化のための検討","author_link":["588287","588286"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"3Dプリンタによるホットスタンプ多層回路における回路の最適化のための検討"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"コードと移動","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2023-01-09","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"芝浦工業大学"},{"subitem_text_value":"芝浦工業大学"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Shibaura Institute of Technology","subitem_text_language":"en"},{"subitem_text_value":"Shibaura Institute of Technology","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/223356/files/IPSJ-HCI23201045.pdf","label":"IPSJ-HCI23201045.pdf"},"date":[{"dateType":"Available","dateValue":"2025-01-09"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-HCI23201045.pdf","filesize":[{"value":"3.1 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"33"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"ffd3f44b-5e12-49b1-bb5f-da88a07adeea","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2023 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"辺見, 優天"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"真鍋, 宏幸"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA1221543X","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8760","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"3D プリンタと転写箔を用いて電子回路を作成する手法が提案されている．導電性と絶縁性の 2 種類の転写箔を押し当てることで，片面に多層の回路パターンを転写することができる．この手法の課題として，転写箔の消費が多いことが挙げられる．転写箔は再利用が難しく，多くの未使用領域を残したまま廃棄せざるを得ない．この課題を解決するために，我々は転写箔の面積を最小化する回路最適化手法について検討を行う．検討を行うために，基板設計を支援する既存ソフトウェアが出力する複数の回路案の中から，転写面積が最小の回路パターンを自動的に選択する実装を行った．選択した回路パターンを印刷するための G-code を生成することもでき，実際に電子回路を印刷できることを確認した．さらに，転写箔の使用量を最小化するための具体的な方法について議論した．","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"8","bibliographic_titles":[{"bibliographic_title":"研究報告ヒューマンコンピュータインタラクション（HCI）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2023-01-09","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"45","bibliographicVolumeNumber":"2023-HCI-201"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"created":"2025-01-19T01:23:13.476231+00:00","id":223356,"links":{}}