{"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00217111","sets":["1164:1579:10818:10892"]},"path":["10892"],"owner":"44499","recid":"217111","title":["AI によるLSIレイアウト上の欠陥検出のための新しい欠陥モデルの検討"],"pubdate":{"attribute_name":"公開日","attribute_value":"2022-03-03"},"_buckets":{"deposit":"6e839fbf-ba0b-449e-b79e-770af3148588"},"_deposit":{"id":"217111","pid":{"type":"depid","value":"217111","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"AI によるLSIレイアウト上の欠陥検出のための新しい欠陥モデルの検討","author_link":["561818","561816","561810","561817","561811","561813","561812","561815","561814","561809"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"AI によるLSIレイアウト上の欠陥検出のための新しい欠陥モデルの検討"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"高信頼性技術","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2022-03-03","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"東京都立大学大学院システムデザイン研究科"},{"subitem_text_value":"東京都立大学大学院システムデザイン研究科"},{"subitem_text_value":"日本大学生産工学部"},{"subitem_text_value":"東京都立大学システムデザイン学部"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Department of Electrical Eng. and Sci., Tokyo Metropolitan University","subitem_text_language":"en"},{"subitem_text_value":"Department of Electrical Eng. and Sci., Tokyo Metropolitan University","subitem_text_language":"en"},{"subitem_text_value":"College of Industrial Technology, Nihon University","subitem_text_language":"en"},{"subitem_text_value":"Department of Electrical Eng. and Sci., Tokyo Metropolitan University","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/217111/files/IPSJ-ARC22248023.pdf","label":"IPSJ-ARC22248023.pdf"},"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-ARC22248023.pdf","filesize":[{"value":"2.4 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"16"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_login","version_id":"aeb24708-548d-4ad1-bc39-7337aad06764","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2022 by the Institute of Electronics, Information and Communication Engineers This SIG report is only available to those in membership of the SIG."}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"川口, 大樹"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"藤田, 樹"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"永村, 美一"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"新井, 雅之"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"福本, 聡"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Hiroki, Kawaguchi","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Itsuki, Fujita","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yoshikazu, Nagamura","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Masayuki, Arai","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Satoshi, Fukumoto","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN10096105","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8574","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"現在，半導体集積回路は様々な製品やシステムの構成に必要不可欠な存在であり，その信頼性を確保することは重要である．本研究では，LSI の回路レイアウトに起因する不良を予測，特定することを目的として AI  技術を用いて回路レイアウトを解析する手法について検討している．今回は，欠陥発生の危険性の有無を畳み込みニューラルネットワークで推定するために，特定の特徴を持つレイアウト図形 (配線パターン) とその周囲の回路レイアウトの構造に起因して欠陥が発生するモデルを検討した．","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告システム・アーキテクチャ（ARC）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2022-03-03","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"23","bibliographicVolumeNumber":"2022-ARC-248"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"updated":"2025-01-19T15:37:08.750674+00:00","created":"2025-01-19T01:17:37.025049+00:00","links":{},"id":217111}