{"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00210319","sets":["6164:6165:9654:10560"]},"path":["10560"],"owner":"44499","recid":"210319","title":["Dynamic Linking Method for an Embedded Component System"],"pubdate":{"attribute_name":"公開日","attribute_value":"2021-03-15"},"_buckets":{"deposit":"386263e7-66e5-4aee-93c2-3c8609d3f999"},"_deposit":{"id":"210319","pid":{"type":"depid","value":"210319","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"Dynamic Linking Method for an Embedded Component System","author_link":["532139","532134","532136","532131","532135","532132","532137","532130","532133","532138"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"Dynamic Linking Method for an Embedded Component System"},{"subitem_title":"Dynamic Linking Method for an Embedded Component System","subitem_title_language":"en"}]},"item_type_id":"18","publish_date":"2021-03-15","item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_18_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"Nagoya University"},{"subitem_text_value":"Nagoya University"},{"subitem_text_value":"OKUMA Corporation"},{"subitem_text_value":"Saitama University"},{"subitem_text_value":"Nagoya University"}]},"item_18_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Nagoya University","subitem_text_language":"en"},{"subitem_text_value":"Nagoya University","subitem_text_language":"en"},{"subitem_text_value":"OKUMA Corporation","subitem_text_language":"en"},{"subitem_text_value":"Saitama University","subitem_text_language":"en"},{"subitem_text_value":"Nagoya University","subitem_text_language":"en"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/210319/files/IPSJ-APRIS2020003.pdf","label":"IPSJ-APRIS2020003.pdf"},"date":[{"dateType":"Available","dateValue":"2021-03-15"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-APRIS2020003.pdf","filesize":[{"value":"2.7 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"5"},{"tax":["include_tax"],"price":"0","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"42"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"c46bbbff-c9d1-4ac4-8cdc-381a26703052","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2021 by the Information Processing Society of Japan"}]},"item_18_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Katsuya, Yamauchi"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Tomoaki, Kawada"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Hiroshi, Oyama"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Takuya, Azumi"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Hiroaki, Takada"}],"nameIdentifiers":[{}]}]},"item_18_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Katsuya, Yamauchi","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Tomoaki, Kawada","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Hiroshi, Oyama","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Takuya, Azumi","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Hiroaki, Takada","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_5794","resourcetype":"conference paper"}]},"item_18_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"This paper presents a dynamic linking method using the TOPPERS Embedded Component System (TECS). Dynamic linking mechanisms (e.g., Shared Object and Dynamic Link Library) are responsible for loading and linking software modules at run-time. Such mechanisms are useful to allow a software module to be combined with other modules which are not known beforehand during the module's development, such as third-party applications and future versions of an application that is intended to be combined with the said module. Another benefit is the ability to update application modules individually, and to reduce the delivery cost of software updates. Those mechanisms have been put into practical use in general-purpose software systems. The use of a dynamic linking mechanism for embedded systems is also being considered; however, existing solutions are not always appropriate for embedded systems because of their tight memory constraints. Therefore, this paper proposes a linking method suitable for embedded systems that utilizes TECS, which has the advantage of ensuring interface consistency.","subitem_description_type":"Other"}]},"item_18_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"This paper presents a dynamic linking method using the TOPPERS Embedded Component System (TECS). Dynamic linking mechanisms (e.g., Shared Object and Dynamic Link Library) are responsible for loading and linking software modules at run-time. Such mechanisms are useful to allow a software module to be combined with other modules which are not known beforehand during the module's development, such as third-party applications and future versions of an application that is intended to be combined with the said module. Another benefit is the ability to update application modules individually, and to reduce the delivery cost of software updates. Those mechanisms have been put into practical use in general-purpose software systems. The use of a dynamic linking mechanism for embedded systems is also being considered; however, existing solutions are not always appropriate for embedded systems because of their tight memory constraints. Therefore, this paper proposes a linking method suitable for embedded systems that utilizes TECS, which has the advantage of ensuring interface consistency.","subitem_description_type":"Other"}]},"item_18_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"18","bibliographic_titles":[{"bibliographic_title":"Proceedings of Asia Pacific Conference on Robot IoT System Development and Platform"}],"bibliographicPageStart":"14","bibliographicIssueDates":{"bibliographicIssueDate":"2021-03-15","bibliographicIssueDateType":"Issued"},"bibliographicVolumeNumber":"2020"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"id":210319,"updated":"2025-01-19T18:11:56.123576+00:00","links":{},"created":"2025-01-19T01:11:33.002935+00:00"}