{"id":208616,"updated":"2025-01-19T18:47:14.668306+00:00","links":{},"created":"2025-01-19T01:09:59.952878+00:00","metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00208616","sets":["1164:3027:9930:10420"]},"path":["10420"],"owner":"44499","recid":"208616","title":["3Dプリンタと転写箔を用いた片面実装多層基板の製作手法"],"pubdate":{"attribute_name":"公開日","attribute_value":"2020-12-01"},"_buckets":{"deposit":"50f85704-3b60-4d6b-b5e4-8691fb6fcfde"},"_deposit":{"id":"208616","pid":{"type":"depid","value":"208616","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"3Dプリンタと転写箔を用いた片面実装多層基板の製作手法","author_link":["523962","523963"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"3Dプリンタと転写箔を用いた片面実装多層基板の製作手法"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"回路,デバイス","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2020-12-01","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"芝浦工業大学"},{"subitem_text_value":"芝浦工業大学"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/208616/files/IPSJ-HCI20190002.pdf","label":"IPSJ-HCI20190002.pdf"},"date":[{"dateType":"Available","dateValue":"2022-12-01"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-HCI20190002.pdf","filesize":[{"value":"4.3 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"33"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"4bc89a71-b235-47d1-b22d-53f17ff44105","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2020 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"今井, 悠平"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"真鍋, 宏幸"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA1221543X","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8760","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"電子配線の立体交差が可能になれば,複雑な電子回路の構築が可能になる.配線の立体交差の実現方法として,両面基板がある.しかし両面基板には複雑な工程によるビアの構築が必要不可欠となるため,個人での基板製作は困難であった.本稿では,我々が提案した 3D プリンタと金属転写箔を使用した電子配線印刷手法を発展させ,配線の立体交差が可能な片面電子基板を製作する手法を提案する.提案手法では,紙やアクリル板などの素材を基材とし,薄い絶縁テープと組み合わせることで片面実装多層基板を製作する.ビアが不要になるため,個人での電子回路製作が容易になると期待できる.製作実験として,4 層の片面実装多層基板を製作した.さらに,製作した基板に電子部品を実装し,電子回路が動作することを確認した.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告ヒューマンコンピュータインタラクション(HCI)"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2020-12-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"2","bibliographicVolumeNumber":"2020-HCI-190"}]},"relation_version_is_last":true,"weko_creator_id":"44499"}}