{"updated":"2025-01-19T19:05:00.885927+00:00","links":{},"id":207699,"created":"2025-01-19T01:09:19.127585+00:00","metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00207699","sets":["1164:2036:10071:10403"]},"path":["10403"],"owner":"44499","recid":"207699","title":["楕円曲線ディジタル署名(ECDSA)ハードウェアモジュールの動作性能評価(II)"],"pubdate":{"attribute_name":"公開日","attribute_value":"2020-11-10"},"_buckets":{"deposit":"11f5b174-864c-4512-893d-dcd36ec94d33"},"_deposit":{"id":"207699","pid":{"type":"depid","value":"207699","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"楕円曲線ディジタル署名(ECDSA)ハードウェアモジュールの動作性能評価(II)","author_link":["519167","519160","519159","519173","519169","519172","519170","519161","519164","519166","519168","519171","519165","519163","519162","519158"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"楕円曲線ディジタル署名(ECDSA)ハードウェアモジュールの動作性能評価(II)"},{"subitem_title":"Evaluation of operating performance of ECDSA hardware module (II)","subitem_title_language":"en"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"信頼性とセキュリティ","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2020-11-10","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"神戸大学科学技術イノベーション研究科"},{"subitem_text_value":"神戸大学科学技術イノベーション研究科"},{"subitem_text_value":"神戸大学科学技術イノベーション研究科"},{"subitem_text_value":"電子商取引安全技術研究組合（ECSEC）"},{"subitem_text_value":"電子商取引安全技術研究組合（ECSEC）"},{"subitem_text_value":"神戸大学科学技術イノベーション研究科"},{"subitem_text_value":"神戸大学科学技術イノベーション研究科"},{"subitem_text_value":"神戸大学科学技術イノベーション研究科"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Graduate School of Science, technology and Innovation, Kobe University","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science, technology and Innovation, Kobe University","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science, technology and Innovation, Kobe University","subitem_text_language":"en"},{"subitem_text_value":"ECSEC Corporation","subitem_text_language":"en"},{"subitem_text_value":"ECSEC Corporation","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science, technology and Innovation, Kobe University","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science, technology and Innovation, Kobe University","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science, technology and Innovation, Kobe University","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/207699/files/IPSJ-SLDM20192023.pdf","label":"IPSJ-SLDM20192023.pdf"},"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-SLDM20192023.pdf","filesize":[{"value":"1.7 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"10"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_login","version_id":"68ede4f6-4f29-442e-b3ef-a92e2eff68e5","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2020 by the Institute of Electronics, Information and Communication Engineers This SIG report is only available to those in membership of the SIG."}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"高橋, 佑弥"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"松丸, 琢弥"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"門田, 和樹"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"佐藤, 俊憲"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"沖殿, 貴朗"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"三木, 拓司"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"三浦, 典之"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"永田, 真"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Yuya, Takahashi","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Takumi, Matsumaru","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Kazuki, Monta","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Toshiyuki, Sato","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Takaaki, Okidono","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Takuji, Miki","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Noriyuki, Miura","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Makoto, Nagata","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA11451459","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8639","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"現代における IoT 機器の需要に対して，ソフトウェアレベルでの公開鍵暗号には消費電力の制約等から限界があり，ハードウェアレベルで改善を行うことが求められている．本研究では，ECDSA を用いたハードウェアモジュールによる広域の IoT ネットワークシステムについて評価した．IoT センサーノードを模した署名生成チップ搭載ボード (複数台) とサーバに接続した署名検証チップ搭載ボード (単一台) により，エッジシステムの署名検証システムを構築し，署名検証のスループットを評価した．前回の報告 [1] では，センサーノードとサーバ間を USB-UART により接続していたが，本報告では Ethernet を利用した．これにより，センサーノードを多重接続した際の検証速度について改善効果を確認した．","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"Research and development is underway on speeding up public-key encryption hardware to meet IoT security demands. We examined the application of elliptic curve digital signature algorithm (ECDSA) hardware module to IoT network systems. A prototype system integrates a set of small boards equipped with a signature generation chip, which mimics an IoT sensor node, and another large board equipped with four signature verification chips connected to servers an IoT concentrator. In this report, we adopted Ethernet as the data connection between IoT sensor nodes to the concentrator, in comparison with the previous setup that had used USB-UART. The system throughput is evaluated and improved in verifying digital signatures from multiple sensor nodes.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"4","bibliographic_titles":[{"bibliographic_title":"研究報告システムとLSIの設計技術（SLDM）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2020-11-10","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"23","bibliographicVolumeNumber":"2020-SLDM-192"}]},"relation_version_is_last":true,"weko_creator_id":"44499"}}