{"links":{},"id":2006473,"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:02006473","sets":["1164:3027:1766467250990:1766467332578"]},"path":["1766467332578"],"owner":"80578","recid":"2006473","title":["FDMプリンタで造形した基板上への導電転写箔を用いた電子回路印刷条件の検討"],"pubdate":{"attribute_name":"PubDate","attribute_value":"2026-01-07"},"_buckets":{"deposit":"8c82e6e1-7c77-4eb3-9ec6-94cacf30191a"},"_deposit":{"id":"2006473","pid":{"type":"depid","value":"2006473","revision_id":0},"owners":[80578],"status":"published","created_by":80578},"item_title":"FDMプリンタで造形した基板上への導電転写箔を用いた電子回路印刷条件の検討","author_link":[],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"FDMプリンタで造形した基板上への導電転写箔を用いた電子回路印刷条件の検討","subitem_title_language":"ja"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"ファブリケーション","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2026-01-07","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"芝浦工業大学"},{"subitem_text_value":"芝浦工業大学"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/2006473/files/IPSJ-HCI26216031.pdf","label":"IPSJ-HCI26216031.pdf"},"date":[{"dateType":"Available","dateValue":"2028-01-07"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-HCI26216031.pdf","filesize":[{"value":"3.4 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"33"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"ee85dc2e-2890-4207-9367-7d86fa4e6325","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2026 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"虞,朱強"}]},{"creatorNames":[{"creatorName":"真鍋,宏幸"}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA1221543X","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8760","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"FDM方式の3Dプリンタと導電転写箔を用いて電子回路を作成する手法を用いることで，3Dプリンタで造形した基板上に電子回路を印刷できる．しかし，造形基板特有の層痕やノズル圧力，印刷速度，さらに基板素材などが電子回路の品質に与える影響については十分に検討されていなかった．本研究では，これらの要因に着目し，FDM方式3Dプリンタ造形基板上への転写箔を用いた電子回路印刷における印刷条件について検討を行う．実験では，電子回路パターンと層痕とのなす角度，印刷速度，押し付け圧力，および基板素材を変化させ，印刷結果を比較・評価した．その結果，最も良好な導電性と印刷精度が得られる条件を特定することができた．さらに，最適条件を用いてTPU基板上に電子回路を形成し，電子部品を実装した結果，電子回路が正常に動作することを確認した．","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"8","bibliographic_titles":[{"bibliographic_title":"研究報告ヒューマンコンピュータインタラクション（HCI）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2026-01-07","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"31","bibliographicVolumeNumber":"2026-HCI-216"}]},"relation_version_is_last":true,"weko_creator_id":"80578"},"created":"2025-12-23T06:49:33.038173+00:00","updated":"2025-12-23T06:49:37.370587+00:00"}