{"links":{},"id":195208,"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00195208","sets":["1164:2822:9758:9759"]},"path":["9759"],"owner":"44499","recid":"195208","title":["水平方向チップ間ワイヤレスバスの解析と設計"],"pubdate":{"attribute_name":"公開日","attribute_value":"2019-03-10"},"_buckets":{"deposit":"56854ac7-7e29-4aef-8316-12d2b534cfec"},"_deposit":{"id":"195208","pid":{"type":"depid","value":"195208","revision_id":0},"owners":[44499],"status":"published","created_by":44499},"item_title":"水平方向チップ間ワイヤレスバスの解析と設計","author_link":["464219","464216","464214","464215","464217","464218","464220","464213"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"水平方向チップ間ワイヤレスバスの解析と設計"},{"subitem_title":"Analysis and Design of Horizontal Inter-Chip Wireless Bus","subitem_title_language":"en"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"回路・デバイス","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2019-03-10","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"東京大学大学院情報理工学系研究科"},{"subitem_text_value":"東京大学工学部"},{"subitem_text_value":"東京大学大学院情報理工学系研究科"},{"subitem_text_value":"東京大学大学院情報理工学系研究科"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Graduate School of Information Science and Technology, The University of Tokyo","subitem_text_language":"en"},{"subitem_text_value":"Faculty of Engineering, The University of Tokyo","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Information Science and Technology, The University of Tokyo","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Information Science and Technology, The University of Tokyo","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/195208/files/IPSJ-EMB19050016.pdf","label":"IPSJ-EMB19050016.pdf"},"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-EMB19050016.pdf","filesize":[{"value":"3.0 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"42"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_login","version_id":"43848fc4-b0d8-46ef-ad13-5b3bd59f8821","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2019 by the Institute of Electronics, Information and Communication Engineers This SIG report is only available to those in membership of the SIG."}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"門本, 淳一郎"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"浅野, 凌治"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"入江, 英嗣"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"坂井, 修一"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Junichiro, Kadomoto","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Ryozi, Asano","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Hidetsugu, Irie","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Shuichi, Sakai","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA12149313","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-868X","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"水平方向チップ間ワイヤレスバスは，チップの外周に沿って形成されたコイル同士の誘導結合を利用することで複数チップ間を無線で接続する技術である．これまでにシミュレーション評価によって基本的な伝送特性が示された段階であり，正方形以外のチップを用いる場合やチップ同士が斜めに配置された場合の伝送特性，あるいはチップ上に存在するリング状配線に流れる渦電流の影響といったものは十分に調査されていなかった．そこで本論文では，チップの形状，チップ同士の相対位置や相対角度の変化に応じた水平方向誘導結合通信特性の変化と，電源リングやシールリングといったリング状配線に流れる渦電流が通信特性に与える影響についてシミュレーションをおこない，詳細な設計理論を明らかにする．さらに，プロトタイプ基板による実測評価をおこなう．プロトタイプ基板上のコイルを介してデータは正常に転送され，3mm 角のコイルを利用した場合において最大 2.6 Gb/s の転送速度を達成した．","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"Implementing large coils and transceiver circuits on each chip enables wireless communication between multiple chips via horizontal inductive coupling and it is possible to realize an embedded system with various shapes. In this paper, we investigate a change of inductive-coupling communication characteristics according to a change of shapes of chips, a relative position and a relative angle between chips. An influence of ring-like wirings such as a power ring and a seal ring on the communication characteristics is also investigated. By these investigations, we clarify the design theory of the horizontal chip-to-chip wireless bus. Experimental results with a prototype in which coils are formed on PCB are shown. The maximum data transfer rate of 2.6 Gb/s is achieved when 3 mm square coil is used.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告組込みシステム（EMB）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2019-03-10","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"16","bibliographicVolumeNumber":"2019-EMB-50"}]},"relation_version_is_last":true,"weko_creator_id":"44499"},"created":"2025-01-19T01:00:12.991581+00:00","updated":"2025-01-19T23:10:32.284692+00:00"}