{"created":"2025-01-19T00:50:23.224491+00:00","updated":"2025-01-20T03:55:25.544706+00:00","metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00182811","sets":["1164:1579:9047:9217"]},"path":["9217"],"owner":"11","recid":"182811","title":["水没プロセッサチップの温度と性能評価"],"pubdate":{"attribute_name":"公開日","attribute_value":"2017-07-19"},"_buckets":{"deposit":"f9f391e9-c90c-4ad4-89fe-949b75a632f1"},"_deposit":{"id":"182811","pid":{"type":"depid","value":"182811","revision_id":0},"owners":[11],"status":"published","created_by":11},"item_title":"水没プロセッサチップの温度と性能評価","author_link":["399276","399274","399277","399275","399272","399273"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"水没プロセッサチップの温度と性能評価"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"電源・冷却","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2017-07-19","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"慶應義塾大学"},{"subitem_text_value":"慶應義塾大学"},{"subitem_text_value":"慶應義塾大学"},{"subitem_text_value":"情報通信研究機構"},{"subitem_text_value":"国立情報学研究所"},{"subitem_text_value":"国立情報学研究所"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/182811/files/IPSJ-ARC17227010.pdf","label":"IPSJ-ARC17227010.pdf"},"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-ARC17227010.pdf","filesize":[{"value":"1.3 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"16"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_login","version_id":"07f75151-2a12-47e9-a165-888ee6d3d212","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2017 by the Institute of Electronics, Information and Communication Engineers This SIG report is only available to those in membership of the SIG."}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"十時, 知滉"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"松谷, 宏紀"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"天野, 英晴"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"藤原, 一毅"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"平澤, 将一"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"鯉渕, 道紘"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN10096105","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8574","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"水はフロリナートや鉱物油一般と比べて熱伝達率が高い．そこで，水による直接冷却によって，従来の空冷，液浸冷却方式と比べて，チップの温度を下げることが期待できる．我々は水との電気絶縁性を確保するために薄い (例 : 120 - 150 µm) パリレン膜でコンピュータを覆い，水中に設置する水没コンピュータを提案してきた．本報告では，まず，冷却効率を高めるために，大きな熱抵抗となるパリレン膜をコンピュータの基板表面から一部除去する膜割技術を提案し，実機と HotSpot 6.0 温度シミュレーションにより高負荷時のプロセッサチップの温度を評価する．次に，消費電力の大きい 3 次元積層チップマルチプロセッサへ水没冷却を適用する．我々は効果的な積層チップの冷却のために，垂直方向のみならず，横方向にも積層することでチップの総冷却面積を大きくする Castle of Chips (CoC) の利用を提案し，HotSpot 6.0 温度シミュレーションにより，温度制約下における OpenMP を用いた NAS 並列ベンチマーク性能を評価する．","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告システム・アーキテクチャ（ARC）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2017-07-19","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"10","bibliographicVolumeNumber":"2017-ARC-227"}]},"relation_version_is_last":true,"weko_creator_id":"11"},"id":182811,"links":{}}