@techreport{oai:ipsj.ixsq.nii.ac.jp:00147504,
 author = {副島, 梨恵 and 翁, 浩ニ and 柴田, 裕一郎 and 小栗, 清 and Rie, Soejima and Koji, Okina and Yuichiro, Shibata and Kiyoshi, Oguri},
 issue = {22},
 month = {Jan},
 note = {解適合格子法の一種であるビルディングキューブ法 (BCM) は計算領域を異なる大きさの直交格子に分割するが，各格子のデータサイズ・演算フローは均一化されており，並列計算との親和性が高い．本稿では，BCM 法によるステンシル計算を FPGA 上に容易に実装可能なフレームワークを高位合成系上にクラスライブラリとして作成した．熱拡散シミュレーションをベンチマークとして，演算性能，メモリアクセス性能及び回路規模を評価し，異なる大きさの格子間のデータ授受機構のオーバーヘッドを明らかにした．, In building-cube method (BCM), which is one of the adaptive mesh refinement, the computational region is divided into a number of sub-domains with various sizes. One of advantages of the BCM that it suits parallel processing, due to each sub-domain has a similar data size and a similar computing flow in spite of the difference in size. This paper presents implementation of a class library framework on a high-level synthesis system, which aims at enabling easy FPGA implementation of BCM-based stencil computation. The proposed framework is evaluated with a heat conduction simulation as a benchmark application in terms of computing performance, memory performance and hardware amount, so that overheads of a mechanism of data exchange between sub-domains with different size are revealed.},
 title = {ビルディングキューブ法に基づくステンシル計算の高位合成ベースFPGA実装},
 year = {2016}
}