{"created":"2025-01-19T00:21:03.920035+00:00","updated":"2025-01-20T12:54:03.916361+00:00","metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00145428","sets":["1164:1579:7841:8344"]},"path":["8344"],"owner":"11","recid":"145428","title":["3次元積層プロセッサ向けフロアプランナの可視化"],"pubdate":{"attribute_name":"公開日","attribute_value":"2015-10-01"},"_buckets":{"deposit":"3e2dc593-f764-4318-97a8-6a5449f4d8e5"},"_deposit":{"id":"145428","pid":{"type":"depid","value":"145428","revision_id":0},"owners":[11],"status":"published","created_by":11},"item_title":"3次元積層プロセッサ向けフロアプランナの可視化","author_link":["224203","224205","224198","224204","224196","224197","224199","224200","224206","224202","224207","224201"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"3次元積層プロセッサ向けフロアプランナの可視化"}]},"item_type_id":"4","publish_date":"2015-10-01","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"電気通信大学大学院情報システム学研究科"},{"subitem_text_value":"電気通信大学大学院情報システム学研究科"},{"subitem_text_value":"電気通信大学大学院情報システム学研究科"},{"subitem_text_value":"東京大学大学院情報理工学系研究科"},{"subitem_text_value":"電気通信大学大学院情報システム学研究科"},{"subitem_text_value":"東京大学大学院情報理工学系研究科"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Graduate School of Information Systems, University of Electro-Communications","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Information Systems, University of Electro-Communications","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Information Systems, University of Electro-Communications","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Information Science and Technology, University of Tokyo","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Information Systems, University of Electro-Communications","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Information Science and Technology, University of Tokyo","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/145428/files/IPSJ-ARC15217019.pdf","label":"IPSJ-ARC15217019.pdf"},"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-ARC15217019.pdf","filesize":[{"value":"1.3 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"0","billingrole":"16"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_login","version_id":"8f9758dc-ad8e-467d-8975-64df613e7481","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2015 by the Institute of Electronics, Information and Communication Engineers This SIG report is only available to those in membership of the SIG."}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"村田, 篤志"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"野村, 隼人"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"吉見, 真聡"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"入江, 英嗣"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"吉永, 努"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"坂井, 修一"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Atsushi, Murata","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Hayato, Nomura","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Masato, Yoshimi","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Hidetsugu, Irie","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Tsutomu, Yoshinaga","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Shuichi, Sakai","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN10096105","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_source_id_11":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2188-8574","subitem_source_identifier_type":"ISSN"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"TSV の開発により積層間の結線がより自由になり，3 次元積層技術の研究の利用を促進している．我々はプロセッサコア 3 次元化の効果や，そのような世代のプロセッサアーキテクチャのダイ上での配置，配線を簡易的に見積もるために，モジュールレベルの 3 次元積層プロセッサフロアプランナを開発している．今回の展示では，フロアプランナによってモジュールの配置が準最適化されていく様子を動画で表示する．","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"Researches for 3D stacking technology advances according to the development of TSV that introduces more flexible connection between stacked layers. We are developing a module level fioorplanner for 3D processors to estimate the efficiency of the stacked processor and place and route on die. This presentation shows the movies that explains sequence of quasi-optimization for the place of the modules by the floorplanner.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"3","bibliographic_titles":[{"bibliographic_title":"研究報告システム・アーキテクチャ（ARC）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2015-10-01","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"19","bibliographicVolumeNumber":"2015-ARC-217"}]},"relation_version_is_last":true,"weko_creator_id":"11"},"id":145428,"links":{}}