{"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00124850","sets":["6504:8043:8053"]},"path":["8053"],"owner":"1","recid":"124850","title":["HDLによる通信制御用チップの開発環境の構築"],"pubdate":{"attribute_name":"公開日","attribute_value":"1993-09-27"},"_buckets":{"deposit":"7778453d-4add-41e6-a4ec-0e3b04216aaf"},"_deposit":{"id":"124850","pid":{"type":"depid","value":"124850","revision_id":0},"owners":[1],"status":"published","created_by":1},"item_title":"HDLによる通信制御用チップの開発環境の構築","author_link":[],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"HDLによる通信制御用チップの開発環境の構築"},{"subitem_title":"The Development Environment of Communication Control Chips by using the HDL","subitem_title_language":"en"}]},"item_type_id":"22","publish_date":"1993-09-27","item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_22_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"横河電機(株)デバイス研究所"},{"subitem_text_value":"横河電機(株)デバイス研究所"},{"subitem_text_value":"横河電機(株)デバイス研究所"},{"subitem_text_value":"横河電機(株)デバイス研究所"},{"subitem_text_value":"横河電機(株)デバイス研究所"}]},"item_22_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"Devices Laboratory,Yokogawa Electric Corporation","subitem_text_language":"en"},{"subitem_text_value":"Devices Laboratory,Yokogawa Electric Corporation","subitem_text_language":"en"},{"subitem_text_value":"Devices Laboratory,Yokogawa Electric Corporation","subitem_text_language":"en"},{"subitem_text_value":"Devices Laboratory,Yokogawa Electric Corporation","subitem_text_language":"en"},{"subitem_text_value":"Devices Laboratory,Yokogawa Electric Corporation","subitem_text_language":"en"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/124850/files/KJ00001339355.pdf"},"date":[{"dateType":"Available","dateValue":"1993-09-27"}],"format":"application/pdf","filename":"KJ00001339355.pdf","filesize":[{"value":"144.3 kB"}],"mimetype":"application/pdf","accessrole":"open_date","version_id":"21051d83-6ab0-4915-bef5-c91d71a0ba79","displaytype":"detail","licensetype":"license_note"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_5794","resourcetype":"conference paper"}]},"item_22_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN00349328","subitem_source_identifier_type":"NCID"}]},"item_22_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"HDLによるトップダウン設計手法により、通信制御用チップを開発した。その際、効率の良い設計環境を実現するために、汎用シミュレータ(Verilog-XL)を用い、通信制御用チップに有効な開発環境を構築した。本開発環境では、周辺ハードウェアと通信メディアをVerilog-HDLにより記述し、システムレベル・シミュレーションにより、機能検証の精度の向上を実現している。また、Verilog-HDLによる簡易言語インターフェイスを構築し、ワークステーション上でのチップの動作検証を容易にした。我々は、本開発環境を実チップ開発に適用し、その有用性を確認した。本稿では、本開発環境と通信チップ開発での適用例について述べる。","subitem_description_type":"Other"}]},"item_22_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"88","bibliographic_titles":[{"bibliographic_title":"全国大会講演論文集"}],"bibliographicPageStart":"87","bibliographicIssueDates":{"bibliographicIssueDate":"1993-09-27","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"ハードウェア","bibliographicVolumeNumber":"第47回"}]},"relation_version_is_last":true,"weko_creator_id":"1"},"id":124850,"updated":"2025-01-21T02:22:55.765467+00:00","links":{},"created":"2025-01-19T00:04:43.198317+00:00"}