{"metadata":{"_oai":{"id":"oai:ipsj.ixsq.nii.ac.jp:00113747","sets":["1164:2822:7920:7921"]},"path":["7921"],"owner":"11","recid":"113747","title":["GPUを用いたLSI基板の3次元発熱・伝熱シミュレータの構築と評価"],"pubdate":{"attribute_name":"公開日","attribute_value":"2015-02-27"},"_buckets":{"deposit":"01cfcb03-932b-4ef9-858a-0f05225610d7"},"_deposit":{"id":"113747","pid":{"type":"depid","value":"113747","revision_id":0},"owners":[11],"status":"published","created_by":11},"item_title":"GPUを用いたLSI基板の3次元発熱・伝熱シミュレータの構築と評価","author_link":["40193","40202","40196","40198","40200","40201","40203","40199","40197","40204","40195","40194"],"item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"GPUを用いたLSI基板の3次元発熱・伝熱シミュレータの構築と評価"},{"subitem_title":"A Three-dimensional Thermal Generation and Thermal Transfer Simulator for LSI Substrate by GPU","subitem_title_language":"en"}]},"item_keyword":{"attribute_name":"キーワード","attribute_value_mlt":[{"subitem_subject":"設計技術","subitem_subject_scheme":"Other"}]},"item_type_id":"4","publish_date":"2015-02-27","item_4_text_3":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"立命館大学理工学部"},{"subitem_text_value":"立命館大学理工学研究科"},{"subitem_text_value":"立命館大学理工学研究科"},{"subitem_text_value":"立命館大学理工学研究科"},{"subitem_text_value":"立命館大学理工学部"},{"subitem_text_value":"立命館大学理工学部"}]},"item_4_text_4":{"attribute_name":"著者所属(英)","attribute_value_mlt":[{"subitem_text_value":"College of Science and Engineering, Ritsumeikan University.","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science and Engineering, Ritsumeikan University","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science and Engineering, Ritsumeikan University","subitem_text_language":"en"},{"subitem_text_value":"Graduate School of Science and Engineering, Ritsumeikan University","subitem_text_language":"en"},{"subitem_text_value":"College of Science and Engineering, Ritsumeikan University.","subitem_text_language":"en"},{"subitem_text_value":"College of Science and Engineering, Ritsumeikan University.","subitem_text_language":"en"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_publisher":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"情報処理学会","subitem_publisher_language":"ja"}]},"publish_status":"0","weko_shared_id":-1,"item_file_price":{"attribute_name":"Billing file","attribute_type":"file","attribute_value_mlt":[{"url":{"url":"https://ipsj.ixsq.nii.ac.jp/record/113747/files/IPSJ-EMB15036046.pdf"},"date":[{"dateType":"Available","dateValue":"2017-02-27"}],"format":"application/pdf","billing":["billing_file"],"filename":"IPSJ-EMB15036046.pdf","filesize":[{"value":"1.2 MB"}],"mimetype":"application/pdf","priceinfo":[{"tax":["include_tax"],"price":"660","billingrole":"5"},{"tax":["include_tax"],"price":"330","billingrole":"6"},{"tax":["include_tax"],"price":"0","billingrole":"42"},{"tax":["include_tax"],"price":"0","billingrole":"44"}],"accessrole":"open_date","version_id":"d81c5d0e-5388-4f8f-bb11-0d726f67e6a9","displaytype":"detail","licensetype":"license_note","license_note":"Copyright (c) 2015 by the Information Processing Society of Japan"}]},"item_4_creator_5":{"attribute_name":"著者名","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"渡邊, 聖剛"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"大村, 崇"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"北川, 友貴"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"林, 磊"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"孟, 林"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"福井, 正博"}],"nameIdentifiers":[{}]}]},"item_4_creator_6":{"attribute_name":"著者名(英)","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"Shougo, Watanabe","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Takashi, Omura","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Yuuki, Kitagawa","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Lai, Lin","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Lin, Meng","creatorNameLang":"en"}],"nameIdentifiers":[{}]},{"creatorNames":[{"creatorName":"Masahiro, Fukui","creatorNameLang":"en"}],"nameIdentifiers":[{}]}]},"item_4_source_id_9":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AA12149313","subitem_source_identifier_type":"NCID"}]},"item_4_textarea_12":{"attribute_name":"Notice","attribute_value_mlt":[{"subitem_textarea_value":"SIG Technical Reports are nonrefereed and hence may later appear in any journals, conferences, symposia, etc."}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourceuri":"http://purl.org/coar/resource_type/c_18gh","resourcetype":"technical report"}]},"item_4_description_7":{"attribute_name":"論文抄録","attribute_value_mlt":[{"subitem_description":"近年，回路の高集積化に伴う発熱の増大により，熱設計が重要となっている．熱設計を行う解決策に熱解析シミュレーションがあるが，計算量が膨大となる．我々はこれまで GPU を用いた 2 次元熱回路網モデルによる高速伝熱シミュレータを実現した．しかし，2 次元熱回路網モデルでは垂直方向の熱分布の解析精度が不十分である．本研究では 3 次元での熱分布を考慮した 3 次元熱回路網モデルを提案する．既存の回路行列圧縮手法を 3 次元での解析に向けて拡張し，GPU を用いた 3 次元回路の解析計算の効率化を図った．その結果 3 次元の伝熱解析の高精度化を実現した．さらに，GPU の並列演算により，CPU のみと比べて最大約 14.6 倍の高速化を達成した．","subitem_description_type":"Other"}]},"item_4_description_8":{"attribute_name":"論文抄録(英)","attribute_value_mlt":[{"subitem_description":"Recently, thermal design is important by the increased heat generated with the high integration of circuits. There is a thermal analysis simulation for the solutions, but the amount of calculation is huge and time consuming. We have realized a high-speed thermal transfer simulator by two-dimensional thermal network model which uses a GPU. But analysis accuracy of thermal distribution in the vertical direction is insufficient. In this study, we propose a three-dimensional thermal network model considering the thermal distribution in three-dimensional. And we tried the efficiency of analytical calculation of the three-dimensional circuit using GPU by extension of existing circuit matrix compression approach for the analysis of three-dimensional. As a result, we have achieved improving the accuracy of analyzing the three-dimensional thermal transfer. Furthermore, we have achieved about 14.6 times speed-up than a CPU program while accelerating the speed of calculation by using GPU parallel computing.","subitem_description_type":"Other"}]},"item_4_biblio_info_10":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicPageEnd":"6","bibliographic_titles":[{"bibliographic_title":"研究報告組込みシステム（EMB）"}],"bibliographicPageStart":"1","bibliographicIssueDates":{"bibliographicIssueDate":"2015-02-27","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"46","bibliographicVolumeNumber":"2015-EMB-36"}]},"relation_version_is_last":true,"weko_creator_id":"11"},"id":113747,"updated":"2025-01-20T19:31:30.118637+00:00","links":{},"created":"2025-01-18T23:55:16.795164+00:00"}