2024-03-28T18:17:25Zhttps://ipsj.ixsq.nii.ac.jp/ej/?action=repository_oaipmhoai:ipsj.ixsq.nii.ac.jp:001461592023-04-27T10:00:04Z01164:02036:07856:08381
LSI基板パッケージの3次元伝熱シミユレータの構築と評価Construction and Evaluation of Three-Dimensional Heat Transfer Simulator for LSI Packagesjpn予測と測定http://id.nii.ac.jp/1001/00146126/Technical Reporthttps://ipsj.ixsq.nii.ac.jp/ej/?action=repository_action_common_download&item_id=146159&item_no=1&attribute_id=1&file_no=1Copyright (c) 2015 by the Institute of Electronics, Information and Communication Engineers This SIG report is only available to those in membership of the SIG.立命館大学大学院理工学研究科立命館大学大学院理工学研究科立命館大学大学院理工学研究科立命館大学大学院理工学研究科立命館大学大学院理工学研究科立命館大学大学院理工学研究科渡邊, 聖岡大村, 崇北川, 友貴林, 嘉孟, 林福井, 正博近年,回路の高集積化に伴う発熱の増大により,熱設計が重要となっている.熱設計を行う解決策に熱解析シミュレーションがあるが,計算量が膨大となる.本研究では 3 次元での熱分布を考慮し,GPU を用いて解析計算の効率化を図った.その結果,3 次元の伝熱解析の高精度化を実現した.さらに,GPU の並列演算により,CPU のみと比べて最大約 22.8 倍の高速化を達成した.本稿においては,対流を考慮するため,熱伝達率を導入した.また実測や別のシミュレーションと結果を比較し,精度の信頼性を検証した.In recent years, thermal design is important by the increased heat generated with the high integration of circuits. There is a thermal analysis simulation for the solutions, but the amount of calculation is huge and time consuming. In this study, we consider the thermal distribution in three-dimensional, and we tried the efficiency of analytical calculation of the three-dimensional circuit using GPU. As a result, we have achieved improving the accuracy of analyzing the three-dimensional thermal transfer. Furthermore, we have achieved about 22.8 times speed-up than a CPU program while accelerating the speed of calculation by using GPU parallel computing. In this paper, we introduce heat transfer coefficient into our simulator to consider convection. And we compare our analysis results with the test results and another analysis results, and verify the accuracy of our simulation.AA11451459研究報告システムとLSIの設計技術(SLDM)2015-SLDM-17333162015-11-242188-86392015-11-19